And here we’ve been complaining about Flat Pack No-Lead chips when this guy is prototyping with Ball Grid Array in a Wafer-Level Chip Scale Package (WLCSP). Haven’t heard that acronym before?

Instead of convenient pins, BGA parts have tiny metallic balls on which solder is applied, a board is thrown through a reflow oven, and hopefully at the end, everything works. Sometimes these ...

BGA beat St. George's in the DII-A semifinal Thursday and faces PCA, for a fifth time this season in Saturday's TSSAA ...

Follow all the Division II state championship game action throughout Saturday from the TSSAA basketball state tournament in ...

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The Gryphons scored just six points in the second as BGA caught fire in an eventual ... It was 35-35, we get our hands on the ball and lose it — they get a three," Wilkes explained.