近日，楷登电子（Cadence）亚太区资深技术总监张永专先生受邀于上海参加了 SEMICON CHINA 2025，并发表了题为《AI 驱动半导体与系统设计》的演讲。他从 EDA 企业视角出发，深入剖析AI 为行业带来的机遇与挑战，分享 Cadence运用 AI 技术在半导体与系统设计领域的创新应用成果并展示Cadence推动行业前沿创新的思路与实践。

As technology advances, PCBs themselves are becoming more complex, requiring intricate designs and precise development.

used Cadence® OrbitIO™ interconnect designer and Cadence SiP Layout to reduce their packaging design time by 60 percent over their previous methodology. OrbitIO and SiP Layout enable automated ...

Anirudh Devgan, the CEO of Cadence, recently remarked that the company's AI-assisted chip design tools enable chip ... verification, PCB and package and system analysis, it is a pretty rich ...