近日，光电共封装CPO板块（Chip Package On）在资本市场上的表现引发了投资者的广泛关注。根据证券之星的报告，3月14日，光电共封装CPO板块整体上涨2.71%，其中中天科技更是以突出表现领涨板块，吸引了大量主力资金的追捧。与此同时，上证指数和深证成指也有着良好的表现，分别上涨了1.81%和2.26%。

在智能设备领域，兴森科技近日在互动平台上透露，其新研发的CSP（Chip Scale Package）封装基板正主要应用于存储芯片、射频芯片以及MEMS（Micro-Electro-Mechanical Systems）芯片等多个领域。随着对高性能芯片的需求不断增加，这一创新技术无疑为设备制造商提供了更强的设计和应用自由度。

Consumers would have been able to purchase this now-recalled product since earlier this month, the company announced.

As such, the result is a chip that’s flat to the PCB like an SMD component, but with leads that extend much farther out than any traditional package. Obviously, the body of a DIP chip is still ...

Each chip is tested on the wafer. Bad chips are marked for elimination while the good ones are sliced out, placed into packages and connected by tiny wires or solder balls. The package is then ...

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For Pentium 4 and Celeron D in LGA775 chip package. Includes Ethernet and HD Audio. 915GL includes graphics and supports 4GB dual channel DDR RAM; 915PL has PCI Express x16 for external graphics ...

A coalition of nine European Union countries, led by the Netherlands, has been formed to accelerate plans for a potential ...

The amount of data that needs to move around a chip is growing exponentially, driven by the rollout of AI and more sensors ...

Defining whether a 2.5D device is a printed circuit board shrunk down to fit into a package, or is a chip that extends beyond the limits of a single die, may seem like hair-splitting semantics, but it ...