来自MSN2 个月
AMD granted a glass substrate patent to revolutionize chip packaging — Intel, Samsung ...
only this time will they be constructed on one side of the glass wafer, requiring a new production method. The patent also describes a method for bonding multiple glass substrates using copper ...
pv magazine International3 年
Chinese PV Industry Brief: Increasing wafer prices and new glass and polysilicon orders
For the new G12 wafers, the new price is RMB5.60 per piece. Longi priced its p-type M6 (166x223mm, 175um thickness) monocrystalline wafer at RMB3.35 per piece while, for the G1 size (158.75x223mm ...