GOWIN Semiconductor Corp. NUREMBERG, Germany, March 06, 2025 (GLOBE NEWSWIRE) -- Embedded OEMs in the industrial and consumer market segments can discover innovative solutions for motor control ...

allowing GOWIN FPGA designers to easily integrate USB 2.0 connectivity without the need for additional silicon devices. GOWIN’s solution extends its broad support for USB connectivity over a large ...

GOWIN Semiconductor New 22nm High-Performance FPGA family - Arora V (Monday Sep. 26 ... along with MIPI hard core single lane module at up to 2.5Gbps, and DDR3 interfacing at speeds up to 1333 Mbps.

The demonstration designs, as well as the company’s broad portfolio of low-density LittleBee and mid-range Arora V FPGA products, will be available to view at the GOWIN booth 3A-340 at Embedded ...

The demonstration designs, as well as the company’s broad portfolio of low-density LittleBee and mid-range Arora V FPGA products, will be available to view at the GOWIN booth 3A-340 at Embedded ...

The demonstration designs, as well as the company's broad portfolio of low-density LittleBee and mid-range Arora V FPGA products, will be available to view at the GOWIN booth 3A-340 at Embedded World.

NUREMBERG, Germany, March 06, 2025 (GLOBE NEWSWIRE) -- Embedded OEMs in the industrial and consumer market segments can discover innovative solutions for motor control and video bridging as GOWIN ...