资讯

Design-Reuse1 个月
1.8V General Purpose I/O Staggered Pad Set
These 22nm libraries are available in inline and staggered CUP wire bond implementations with a flip chip option ... and a full complement of power cells along with corner and spacer cells to assemble ...
Design-Reuse24 天
3.3V General Purpose I/O Staggered Pad Set
These 22nm libraries are available in inline and staggered CUP wire bond implementations with a flip chip option ... and a full complement of power cells along with corner and spacer cells to assemble ...