YINCAE, a leading innovator in advanced materials solutions, today announced the launch of its groundbreaking underfill material, UF 158UL.

Master Bond EP114 is a two component, low viscosity, NASA low outgassing rated, heat cured epoxy that can be effectively utilised for under fill, coating, impregnating, and porosity sealing ...

Yincae UF 158UL underfill is said to fill gaps as small as 10 microns, even in 100x100mm chips. Unique formulation cures rapidly at room temperature. Provides protection against thermal stress, ...