From thinning and trimming to bonding and debonding, 3D package quality is built on precise and extremely thin wafer ...

A technical paper titled “SEMI-PointRend: Improved Semiconductor Wafer Defect Classification and Segmentation as Rendering” was published (preprint) by researchers at imec, University of Ulsan, and KU ...

these signals in turn correlate closely with the effects that each defect would create on the wafer. Defects are therefore automatically classified as printing or non-printing (relative to a given ...

Wafer probing was courtesy of an old Electroglas ... This particular test looks for defects in the pad ring, surrounding the die core, or possibly within the package. This works by programming ...

The Chinese module maker and the Australian National University utilized phosphorus diffusion gettering and another defect mitigation ... circuit regions of the wafer. “The most surprising ...

even if they come from the same wafer. This is where chip binning comes in. After dicing, each die is tested and sorted based on factors like speed, power efficiency, and defect count. Only the ...