A new technical paper titled “Defect Analysis and Built-In-Self-Test for Chiplet Interconnects in Fan-out Wafer-Level ...

From thinning and trimming to bonding and debonding, 3D package quality is built on precise and extremely thin wafer ...

Wafers are shipped out in a plastic ‘boat ... capable of sourcing or sinking current into a pin and taking measurements. This allows defects such as disconnected or shorted pins, and pin ...

these signals in turn correlate closely with the effects that each defect would create on the wafer. Defects are therefore automatically classified as printing or non-printing (relative to a given ...

even if they come from the same wafer. This is where chip binning comes in. After dicing, each die is tested and sorted based on factors like speed, power efficiency, and defect count. Only the ...