NOVOSENSE Microelectronics has announced the launch of the NSUC1500-Q1, a highly integrated System-on-Chip (SoC) designed to ...

Infineon Technologies AG has introduced the world’s first gallium nitride (GaN) power transistors with integrated Schottky ...

Microchip Technology announces the release of its BR235 and BR235D series of 25A QPL hermetically sealed electromechanical ...

STMicroelectronics has introduced two new automotive NFC readers in its ST25R portfolio, delivering superior wake-up and ...

Infineon Technologies AG has introduced the world’s first gallium nitride (GaN) power transistors with integrated Schottky ...

TDK Corporation has expanded its Micronas HVC 5x embedded motor controller family with the HVC 5481G for automotive ...

Understand the role of dataset size in AI training. Discover factors like complexity and quality that impact requirements.

ETSI releases the first Report that outlines a comprehensive analysis of advanced Integrated Sensing and Communication (ISAC) use cases and deployment scenarios, setting the foundation for future 6G ...

TDK Corporation has expanded its CGA series for automotive multilayer ceramic capacitors (MLCCs) to 10 µF at 100 V in 3225 size (3.2 x 2.5 x 2.5 mm – L x W x H), with X7R characteristics (Class Ⅱ ...

OKW has introduced a new machining service for LED backlighting as part of its enclosure customization options. This service ...

Understand cable impedance: explore the differences between 50-ohm and 75-ohm standards in RF design for improved performance ...

Stackpole Electronics Inc. has introduced the CSSU2512, a new current sense chip resistor designed to handle high power in a ...