This shift comes as HBM and chip-on-wafer-on-substrate (CoWoS) technology growth has begun to slow amid issues related to overheating, power consumption, and cost challenges taking hold.

Global Unichip (GUC), the advanced ASIC company, has announced that it has successfully taped-out the world’s first HBM4 ...

TSMC produces over 90% of the world’s advanced AI chips, powering major products like Nvidia’s H100 and Google’s TPU. Learn ...

It allows shorter routing, better signal integrity, higher speed and lower power consumption than traditional zig-zag HBM bus routing ... GUC’s design for CoWoS and interposer supports 112G-LR SerDes ...

It contains full functional HBM3 Controller and PHY IP and vendor’s HBM3 memory using TSMC’s industry leading CoWoS® technology. HBM memory vendors keep aggressive roadmap increasing throughput and ...

UCIe product line is optimized for all types of CoWoS and for future TSMC's SoW-X ... performance and lowest power 2.5D/3D chiplet and HBM interface IPs," said Igor Elkanovich, CTO of GUC.

Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that it has successfully taped out the world's first ...