最近几年，Intel处理器的封装技术开始多点开花，EMIB 2.5D、Foveros 3D、EMIB 3.5D、Foveros Direct 3D等各种方式层出不穷，经常还会混合搭配使用，从而制造更加复杂、强大的芯片。 这些技术并非一朝一夕之功，而是长期发展的结果，比如基于EMIB 2.5D的首个产品Kaby Lake-G ...

Measles is caused by a highly contagious virus that’s airborne and spreads easily when an infected person breathes, sneezes or coughs. It is preventable through vaccines, and has been considered ...