EMIB, Embedded Multi-Die Interconnect Bridge，嵌入式多芯片互联桥，是一种聪明且灵活的先进封装技术，在需要高密度互连的芯片部位通过将硅片嵌入基板，形成高密度互连桥。其他区域则通过基板进行互连。 如下所示为EMIB的示意图和剖面图，可以看出，在密度高的互连 ...

Co-EMIB技术通过使用 EMIB 和 Foveros 的组合来融合 2D 和 3D 的技术，EMIB负责提高水平互连的密度，Foveros负责打通垂直互连通道，通过 Co-EMIB技术可将多达几十个芯片放入一个封装中。 Co-EMIB 架构基于与配套晶片和堆叠芯片复合体的高密度连接，实现了更大范围的互联 ...

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对于先进封装，许多人都将目光转向了晶圆级先进封装，然而Mark Gardner却说EMIB 2.5D才是AI领域的理想选择，这是为什么？ 先进封装的产能限制 3D先进 ...

You can create a release to package software, along with release notes and links to binary files, for other people to use. Learn more about releases in our docs.

Max, formerly known as HBO Max, officially has a new logo on Sunday night, March 30. The new logo for Warner Bros. Discovery's steaming platform was unveiled on Sunday evening. The new logo gives ...

生成式AI的时代正在到来，AI模型越来越强大，对算力的需求越来越高，而AI算力的提升，又进一步刺激更庞大模型的诞生。 在提升AI芯片性能的过程 ...