Tucson, AZ USA Abstract : Over 81% of new digital designs utilize Field Programmable Gate Arrays (FPGAs). With FPGA packages exceeding 1,000 pins, with Ball Grid Array (BGA) solder bumps providing the ...

The effects of the distribution of power and ground vias in C4/BGA type of packages are studied. Two types of via distributions are evaluated. One type is that vias are concentrated in the core area.

You don’t need much – the most exotic tool is a BGA rework station, holding the mainboard steady&stiff and heating a specific large chip on the board with an infrared lamp from above.

If a pad ring is developed to support only the simplest of functions ... The pads are, in turn, connected to the package through a solder ball in much the same way that a ball grid array (BGA) package ...

flip chip stacked chip scale packages that are used to stack memory digital baseband, and as applications processors in mobile devices; flip-chip ball grid array packages for various networking ...

The MAX 10 10M40 and 10M50 product lines are now offered in variable pitch BGA packages. This new package option significantly increases the value of these highly integrated devices by reducing ...

It’s official, we’re living in the future. Certainly that’s the only explanation for how [wrongbaud] was able to write a three-part series of posts on hacking a cheap electric toothbrush off ...