The silicon photonics startup has announced new products to tackle interconnect bottlenecks costing enterprises millions in ...

A senior executive from Kaynes Semicon revealed plans for the company to become the first in India to package chips by July, ...

在智能设备领域，兴森科技近日在互动平台上透露，其新研发的CSP（Chip Scale Package）封装基板正主要应用于存储芯片、射频芯片以及MEMS（Micro-Electro-Mechanical Systems）芯片等多个领域。随着对高性能芯片的需求不断增加，这一创新技术无疑为设备制造商提供了更强的设计和应用自由度。

As such, the result is a chip that’s flat to the PCB like an SMD component, but with leads that extend much farther out than any traditional package. Obviously, the body of a DIP chip is still ...

Kaynes Semicon aims to become India's first producer of packaged semiconductor chips by July. They plan to deliver initial ...

Lightmatter has released two pieces of technology that are aimed at speeding up the connections between AI chips.

Each chip is tested on the wafer. Bad chips are marked for elimination while the good ones are sliced out, placed into packages and connected by tiny wires or solder balls. The package is then ...

It's literally the hottest chip in the world, and only one chip comes in a package – the package being a coffin-shaped box. SEE ALSO: Two girls immediately regret trying the hottest pepper in ...

A coalition of nine European Union countries, led by the Netherlands, has been formed to accelerate plans for a potential ...

The amount of data that needs to move around a chip is growing exponentially, driven by the rollout of AI and more sensors ...