India], March 26: izmo Microsystems, a division of izmo Ltd. (NSE: IZMO) is proud to announce its role as the exclusive ...

High-accuracy packaging in panel level packaging ~ TOKYO, JP / ACCESS Newswire / March 27, 2025 / Toray Engineering Co., Ltd. (head office: Chuo-ku, Tokyo; CEO & COO: Takashi Iwade; hereinafter "Toray ...

President Donald Trump’s trade war and efforts to bring manufacturing back to US shores have put one of his predecessor’s ...

Imec, a research hub in nanoelectronics, in partnership with the State Government of Baden-Württemberg, Germany, is set to ...

Bijoy Das. izmo Microsystems partners with IIT Madras to advance SiP solutions for programmable photonic chip packaging. The CoE-CPPICS has been established on 1st January 2021 in the Department ...

Abxylute is taking everything everyone loved about its original streaming handheld and upgrading the chip so the One Pro can ...

However, compared to wafers, large glass panels warp significantly and are difficult to transfer, and require larger heaters ...

The Nikkei report also cited increased chip output from China as a reason behind slower capacity expansion by other major ...

Lutnick has signaled he could withhold promised Chips Act grants as he pushes companies in line for federal semiconductor ...

The immediate aim of the centre is to provide better solutions for microwave and quantum photonics applications. Prof. Bijoy Krishna Das mentioned "izmo Microsystems has been a key partner in ...

Gallant Micro Machining Co (均華), one of the advanced packaging equipment suppliers to Taiwan Semiconductor Manufacturing Co (台積電), yesterday said it received record orders totaling NT$1 billion (US$30 ...