最近几年，Intel处理器的封装技术开始多点开花，EMIB 2.5D、Foveros 3D、EMIB 3.5D、Foveros Direct 3D等各种方式层出不穷，经常还会混合搭配使用，从而制造 ...

Innovation thrives in collaborative environments that encourage the free exchange of ideas. Intel is committed to building an open ecosystem that’s transparent, secure, and accessible to all. As a ...

(Reuters) - Three Intel board members will not stand for reelection at its 2025 annual meeting, the chipmaker said in a regulatory filing on Thursday, amid a historic transition under newly ...

丰富全面的技术组合 英特尔代工的先进系统封装及测试（Intel Foundry ASAT）的技术组合，包括FCBGA 2D、FCBGA 2D+、EMIB 2.5D、EMIB 3.5D、Foveros 2.5D & 3D和Foveros Direct 3D等多种技术。 左上：FCBGA 2D、右上：EMIB 2.5D、左下：Foveros 2.5D & 3D、右下：EMIB 3.5D · FCBGA ...

丰富全面的技术组合 英特尔代工的先进系统封装及测试（Intel Foundry ASAT）的技术组合，包括FCBGA 2D、FCBGA 2D+、EMIB 2.5D、EMIB 3.5D、Foveros 2.5D & 3D和Foveros Direct 3D等多种技术。 左上：FCBGA 2D、右上：EMIB 2.5D、 左下：Foveros 2.5D & 3D、右下：EMIB 3.5D FCBGA ...

(Reuters) - Three Intel (INTC) board members will not stand for reelection at its 2025 annual meeting, the chipmaker said in a regulatory filing on Thursday, amid a historic transition under newly ...

生成式AI的时代正在到来，AI模型越来越强大，对算力的需求越来越高，而AI算力的提升，又进一步刺激更庞大模型的诞生。 在提升AI芯片性能的过程 ...

A hot potato: Craig Barrett is firing shots at Intel's board over its proposal to break the company up into multiple smaller pieces and sell parts of the business to TSMC. The former Intel CEO ...