OrbitIO interconnect designer capabilities deliver hierarchical multi-substrate-optimized design for SoCs and ASICs across IC package/SiP and systems San Jose, Calif., 04 May 2016 -- Cadence Design ...

SiP technology has been evolving through utilization of various package technology building blocks to serve the market needs with respect to miniaturization, higher integration, and smaller form ...

Nordic Semiconductor, a global leader in low-power wireless connectivity solutions, today announces it will showcase its nRF54L Series advanced multiprotocol Bluetooth LE Systems-on-Chip (SoCs), ...