Microchip has recently released the SAMA7D65 MPU, a high-performance Arm Cortex-A7 embedded processor designed for HMI and ...

May 10 /PRNewswire/-- Inapac Technology, Inc., the leading semiconductor company exclusively focused on DRAM for system-in-package (SiP) applications, today announced a breakthrough solution for ...

近年来，随着电子设备的智能化和集成化发展，芯片封装技术的重要性日益凸显。汉朔科技近期在投资者互动平台对SIP（System in Package）与SOC（System on ...

而汉朔科技的“系统级封装SiP芯片及电子货架标签”技术方案则通过提高集成度，使电子货架标签占用面积更小，为整机的小型化设计提供了可能。搭配出色的可靠性，仿佛为电子产品的轻薄化之路提供了助力。

Amy Cooper, supplier manager at Master Electronics said “We are delighted to have Insight SIP as a new line at Master Electronics. Their leading-edge RF ...

证券之星消息，汉朔科技(301275)04月02日在投资者关系平台上答复投资者关心的问题。 投资者：请问公司的SIP芯片封装技术，与SOC封装技术有何区别？谢谢！ 汉朔科技董秘：尊敬的投资者，您好！通常来讲，SIP（System in Package）芯片封装技术是一种将多个芯片或元件集成在一个封装体内的技术，而SOC（System on ...

advanced packaging and system-in-package (SiP). Currently, advanced packaging technologies for integrating AI chiplets, such as GPUs and memory, primarily consist of two platforms: Si interposer and ...

Apple reportedly not only wants to give iOS 19, iPadOS 19 and macOS 16 a redesign, but also the Apple Watch operating system.