Yet unlike software, where industry leadership can shift in months, success in lithography is a slow-moving race measured in ...

Now, some researchers hope to generate more powerful EUV beams with a particle accelerator that propels electrons to nearly ...

By way of example, TSMC's N3E node as used in the latest Apple chips has gate pitch of at minimum 45 nm and a metal pitch of ...

OpenLight, the world leader in custom PASIC chip design and manufacturing, and Tower Semiconductor (NASDAQ/TASE: TSEM), the ...

Washington, D.C., March 12, 2025 (GLOBE NEWSWIRE) -- The Association of Corporate Counsel (ACC) today announced its 2025 ACC Value Champions , recognizing eight corporate law departments with five ...

Boise State University has qualified a new Aixtron 2D Close Coupled Showerhead MOCVD system for multi-wafer growth of wide ...

Infineon will supply bare semiconductor wafers to CDIL, which the Indian firm will process and use for assembly and packaging to make power chipset for use in products like power inverters, solar ...

Organic semiconductors: An active semiconductor layer composed of organic (carbon-based) materials is used in organic solar ...

In collaboration with Heliene and Suniva, Corning is aiming to produce a module comprised of polysilicon, wafers and cells made in the USA ...

Find the latest automobile Auto Insight, News & Articles from all top sources for the Indian Auto industry on ET Auto.

China is set to mass-produce complex EUV systems as early as 2026. However, this does not seem particularly realistic.

Innovative glass functionalization via ultrasonication creates stable Si–O–C bonds, addressing traditional method limitations ...