近年来，随着电子设备的智能化和集成化发展，芯片封装技术的重要性日益凸显。汉朔科技近期在投资者互动平台对SIP（System in Package）与SOC（System on ...

而汉朔科技的“系统级封装SiP芯片及电子货架标签”技术方案则通过提高集成度，使电子货架标签占用面积更小，为整机的小型化设计提供了可能。搭配出色的可靠性，仿佛为电子产品的轻薄化之路提供了助力。

When the RF is integrated into the SoC with the rest, the fact that it is on the same chip allows up to 50mw of power saving through the elimination ... In fact, when looked at from the perspective of ...

The Bluetooth Low Energy 5.3 chip, developed by Renesas, not only cuts power consumption, but it helps lower an EV’s weight ...

03, 2025) The Swedish National Space Agency (SNSA) has awarded Frontgrade Gaisler, a leading provider of radiation-hardened microprocessors for space missions, a contract to commercialize the first ...

Renesas Electronics has introduced a new Bluetooth chip that combines a number of features in a compact SoC design.

At the heart of this product is MediaTek's 8th-generation neural processing unit, which delivers 50 TOPS (trillions of ...

RENESAS ELECTRONICS DA14533 Bluetooth Low Energy system-on-chip (SoC) combines a radio transceiver, an Arm M0+ ...

The CPU part of the new Snapdragon 8s Gen 4 chip includes a single Kryo Prime core clocked at up to 3.2 GHz and several Kyro ...

Apple is already looking beyond its next generation of M-class chip, designing the future M6 processor that will include an ...