而汉朔科技的“系统级封装SiP芯片及电子货架标签”技术方案则通过提高集成度，使电子货架标签占用面积更小，为整机的小型化设计提供了可能。搭配出色的可靠性，仿佛为电子产品的轻薄化之路提供了助力。

When the RF is integrated into the SoC with the rest, the fact that it is on the same chip allows up to 50mw of power saving through the elimination ... In fact, when looked at from the perspective of ...

The Bluetooth Low Energy 5.3 chip, developed by Renesas, not only cuts power consumption, but it helps lower an EV’s weight ...

03, 2025) The Swedish National Space Agency (SNSA) has awarded Frontgrade Gaisler, a leading provider of radiation-hardened microprocessors for space missions, a contract to commercialize the first ...

Renesas Electronics has introduced a new Bluetooth chip that combines a number of features in a compact SoC design.

RENESAS ELECTRONICS DA14533 Bluetooth Low Energy system-on-chip (SoC) combines a radio transceiver, an Arm M0+ ...

The robust, low-power solutions from Microchip Technology meet stringent automotive standards for reliability in harsh ...

The CPU part of the new Snapdragon 8s Gen 4 chip includes a single Kryo Prime core clocked at up to 3.2 GHz and several Kyro ...

Apple's branding for its multicore system-on-chip (SoC) starting with the A11 that debuted with the iPhone 8. The Bionic chip has four high-efficiency and two high-performance cores. To save ...

Cadence Design Systems, a leading computational software company, has introduced Conformal AI Studio, a suite designed to ...