A new technical paper titled “Defect Analysis and Built-In-Self-Test for Chiplet Interconnects in Fan-out Wafer-Level ...

Abstract: In the semiconductor wafer manufacturing process, it is necessary to inspect the electrical parameters and functions of the wafer to identify the defects in the chip manufacturing process.

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From thinning and trimming to bonding and debonding, 3D package quality is built on precise and extremely thin wafer ...

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Semiconductor Chiller Market is Segmented by Type (Single Channel Chiller, Dual Channel Chiller, Three Channel Chiller), by ...

Two case studies show how advanced high-resolution 3D XRM can detect and visualize defects in Wafer Level Chip Scale Packages (WLCSP) containing RDL and Cu pillar microbumps.

even if they come from the same wafer. This is where chip binning comes in. After dicing, each die is tested and sorted based on factors like speed, power efficiency, and defect count. Only the ...

Deep ultraviolet (DUV) lasers, known for their high photon energy and short wavelengths, are essential in various fields such ...