More and better screening of diced dies is essential to meet the quality and cost goals of the 2.5D/3D-IC era.

A new technical paper titled “Defect Analysis and Built-In-Self-Test for Chiplet Interconnects in Fan-out Wafer-Level ...

Wafers are shipped out in a plastic ‘boat ... capable of sourcing or sinking current into a pin and taking measurements. This allows defects such as disconnected or shorted pins, and pin ...

A new solid-state laser produces 193-nm light for precision chipmaking and even creates vortex beams with orbital angular ...

Achieving integration of semiconducting and superconducting qubits with full industrial 300-mm wafer fabrication.

The system detects not only pattern defects and foreign particles but also ... Traditionally, silicon interposers made from 12-inch silicon wafers have been used, but since wafers are circular ...

Wafer prices climbed from $5,000 for the A7 ... Apple has a chance to adjust manufacturing processes to lower defect density and increase its yields, so the company is in a better position from ...

even if they come from the same wafer. This is where chip binning comes in. After dicing, each die is tested and sorted based on factors like speed, power efficiency, and defect count. Only the ...