Design-Reuse1 年
ADTechnology to start 3nm 2.5D ASIC design project for HPC application
design services and turnkey solutions and distinguished Samsung Foundry’s Design Solution Partner, announced today that it has completed a contract for a 3nm 2.5D ASIC design for HPC application ...
Semiconductor Engineering1 年
2.5D Integration: Big Chip Or Small PCB?
Defining whether a 2.5D device is a printed circuit board shrunk down to fit into a package, or is a chip that extends beyond the limits of a single die, may seem like hair-splitting semantics, but it ...
Design-Reuse11 年
Open-Silicon and GLOBALFOUNDRIES Demonstrate Custom 28nm SoC Using 2.5D Technology
November 22, 2013-- Open-Silicon, Inc., and GLOBALFOUNDRIES today announced the industry's first demonstration of a functional system-on-chip (SoC) solution featuring two 28nm logic chips, with ...
Semiconductor Engineering3 年
A Practical Approach To DFT For Large SoCs And AI Architectures, Part II
Part I of this article discusses the design-for-test (DFT) challenges of AI designs and strategies to address them at the die level. This part focuses on the test requirements of AI chips that ...