“Copper pillar is now the mainstream interconnection for flip-chip, but it has not completely displaced standard lead-free bumps,” he said. “In terms of production volume, approximately 65% to 70% of ...

But with the scaling and rapid developments in advanced packaging — implementing TSVs, fan-out packaging with redistribution layers, and copper pillar bumps — electromigration has emerged as a major ...

Command/Address Block of DDR3/DDR4/LPDDR2/LPDDR3 Combo PHY supporting 2-rank application for Copper Pillar Bump Flip Chip Version; UMC 40nm LP LVT/RVT LowK Logic Process Data Block of DDR3/DDR4/LPDDR2 ...