The Cobra ® ICP plasma source generates high-density reactive species at low pressure. Substrate DC bias is determined by a separate RF generator ... and outstanding uniformity with clean smooth ...

Reactive Ion Etch (RIE) is a physical etch process. A rich plasma has been made just above the wafer, and the ions are expedited toward the surface to generate a highly powerful anisotropic etch.

More information: Yu-Bin Shin et al, Novel transparent high-entropy sesquioxide ceramics with high physicochemical plasma etching resistance, Journal of Advanced Ceramics (2024). DOI: 10.26599/JAC ...