Additionally, for Intel’s advanced packaging tech like Foveros and EMIB which depend on global supply chains, higher costs for substrate materials can slow production. All these may hit harder ...

The leaked intel allegedly allowed Tren de Aragua gang members to evade arrest at the time. The department already uses polygraph exams during the hiring process of Customs and Border Protection ...

Amid intense competition in the semiconductor industry, Intel Corporation INTC fell short of expectations and lagged its peers. However, with Lip-Bu Tan being appointed as its new CEO, can Intel ...

Semiconductor giants Intel and TSMC are reportedly teaming up. The two firms are said to have reached a tentative agreement to create a joint venture that will operate Intel’s chipmaking ...

Pat Gelsinger's leadership at Intel ended abruptly as the company's market position deteriorated, marked by significant strategic missteps and revenue plummeting. New CEO Lip-Bu Tan aims to ...

丰富全面的技术组合 英特尔代工的先进系统封装及测试（Intel Foundry ASAT）的技术组合，包括FCBGA 2D、FCBGA 2D+、EMIB 2.5D、EMIB 3.5D、Foveros 2.5D & 3D和Foveros Direct 3D等多种技术。 左上：FCBGA 2D、右上：EMIB 2.5D、左下：Foveros 2.5D & 3D、右下：EMIB 3.5D · FCBGA ...

These processors are expected to showcase advancements in compute chiplets and packaging technologies, including Foveros Direct. While Intel's CPU roadmap appears strong, its GPU division faces ...

COLUMBUS, Ohio (WCMH) — Intel released its annual 2024 report and 2025 forecast, addressing financial and political concerns that will affect the Ohio One plant. On Thursday, Intel released both ...

丰富全面的技术组合 英特尔代工的先进系统封装及测试（Intel Foundry ASAT）的技术组合，包括FCBGA 2D、FCBGA 2D+、EMIB 2.5D、EMIB 3.5D、Foveros 2.5D & 3D和Foveros Direct 3D等多种技术。 左上：FCBGA 2D、右上：EMIB 2.5D、左下：Foveros 2.5D & 3D、右下：EMIB 3.5D FCBGA ...

英特尔代工的先进系统封装及测试（Intel Foundry ASAT）的技术组合，包括 FCBGA 2D、FCBGA 2D+、EMIB 2.5D、EMIB 3.5D、Foveros 2.5D & 3D 和 Foveros Direct 3D 等多种技术。 FCBGA 2D + 作为传统封装技术的升级版本，展现了显著的性能提升。该技术采用多层基板堆叠架构，通过局部高 ...

最近几年，Intel处理器的封装技术开始多点开花，EMIB 2.5D、Foveros 3D、EMIB 3.5D、Foveros Direct 3D等各种方式层出不穷，经常还会混合搭配使用，从而制造 ...

丰富全面的技术组合 英特尔代工的先进系统封装及测试（Intel Foundry ASAT）的技术组合，包括FCBGA 2D、FCBGA 2D+、EMIB 2.5D、EMIB 3.5D、Foveros 2.5D & 3D和Foveros Direct 3D等多种技术。 左上：FCBGA 2D、右上：EMIB 2.5D、 左下：Foveros 2.5D & 3D、右下：EMIB 3.5D FCBGA ...