Huawei, SMIC reportedly advancing LDP lithography, eye 3Q25 trial, 2026 rollout China is making significant strides in ...

Their appointments and past attacks on intelligence agencies are unlikely to reassure anxious career officials in the IC. The legacy of the Russia investigation still shapes the worldview and ...

A new technical paper titled “Assessing Design Space for the Device-Circuit Codesign of Nonvolatile Memory-Based Compute-in-Memory Accelerators” was published by TSMC researchers. “Unprecedented ...

While the first part of this article series focused on DRAM basics and peripheral circuits, this part will provide a detailed account of DRAM periphery, explaining different generations of thermally ...

The five largest of these IC product segments in terms of sales volume and shipments are shown in Figure 1. DRAM and NAND flash are expected to repeat as the two largest IC segments again in 2020 ...

The goal is to build nine fabs, but only one fab is actually under construction today. It is focusing on 3D NAND, where it is sampling a 32-layer device with a 64-layer technology in R&D. Two other ...

Intel’s three decades of developing expertise in memory has resulted in an optimized 3D NAND floating gate architecture and manufacturing process. This process leadership has enabled Intel to quickly ...