近年来，随着电子设备的智能化和集成化发展，芯片封装技术的重要性日益凸显。汉朔科技近期在投资者互动平台对SIP（System in Package）与SOC（System on ...

AI技术的快速发展正在深刻改变我们的工作方式。从简单的数据处理到复杂的创意生成，AI工具的应用场景不断扩大。然而，许多人对AI替代人类工作的担忧也在加剧。实际上，AI并非要取代人类，而是作为工具，帮助我们更高效地完成任务。例如，在内容创作领域，AI可 ...

A complete system packaged in one housing. A system in package (SiP) contains several ICs (chips) including a microprocessor on a single substrate such as ceramic or laminate. A SiP is really a ...

Amy Cooper, supplier manager at Master Electronics said “We are delighted to have Insight SIP as a new line at Master Electronics. Their leading-edge RF ...

Atmel(R) Corporation (Nasdaq: ATML) announced today the availability of a new System-in-Package (SiP) solution for LIN automotive networking applications. The ATA6617, featuring maximum ...

Patented Approach Eliminates Memory Burn-In Requirements, Ensuring High Quality and Reliability at the Die Level SAN JOSE, Calif., May 10 /PRNewswire/-- Inapac Technology, Inc., the leading ...

Fan-Out Wafer Level Packaging (FOWLP) has been established as one of the most versatile packaging technologies in the recent past and already accounts for a market value of over 1 billion USD due to ...

US-based Master Electronics has added RF modules to its offering with the signing of French RF module specialist, Insight SIP ...

China's leading EDA software company, Empyrean Technology, announced plans to acquire a majority stake in Shanghai-based Xpeedic Technology, a provider of EDA and system-in-package (SiP) design ...

PRNewswire/ -- izmo Microsystems, a division of izmo, Inc parent - izmo Ltd. (NSE: IZMO) is proud to announce its role as the exclusive industry partner with IIT Madras in a groundbreaking project at ...