Syagrus Systems provides leading edge semiconductor wafer grinding, dicing, inspection, & pick & place packaging services to the electronics industry worldwide.

Syagrus Systems manufactures wafer die sorting machines for use in your application. Each of our machines runs on updated software and has high output capabilities.

Syagrus Systems is a premier source for silicon wafer backend processing and die-sorting equipment manufacturing services located in the Twin Cities of Minneapolis and St. Paul, Minnesota. We believe your success is the driving force behind our own success.

Syagrus Systems specializes in wafer polishing and post-backgrind relief. Our silicon CMP process prepares your wafers for additional services and is ideal for electronic applications requiring flexible circuits.

Syagrus Systems provides world-class post-fab processing for silicon wafers and semiconductor wafers. As an ISO 9001:2015 certified wafer dicing manufacturer, we are dedicated to continuously improving our services to give you a competitive edge.

Syagrus Systems utilizes a diamond-resin bonded grinding wheel to remove the silicon material from the back of a wafer. Our experienced specialists efficiently remove the bulk of substrate material on the wafer before the final finish grind, or polish.

Manufacturing and processing silicon wafers for RFID technologies requires extreme precision, accuracy, and repeatability. No two OEM productions are the same. Syagrus Systems is prepared to offer a variety of wafer and die shapes, forms, and configurations to match your requirements.

Syagrus Systems is one of the industry’s leading post-fab, back-end silicon wafer service providers. Whether you require one or several processes, we have the equipment and expertise to complete your project through fast lead times and worry-free silicon wafer services.

Contact Syagrus Systems for silicon wafer backgrinding , wafer dicing , die sorting, and inspection. We serve electronics manufacturers and OEMs worldwide.

Syagrus Systems' recent addition of two new pieces of key processing equipment, a Strasbaugh wafer grinder and an MTI metrology system, give the silicon wafer processing company increased backgrinding capacity and even more accurate measurement capabilities.